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Manufacturing Capabilities & Information
Quickturn prototyping, pre-production, and low to high volume production assembly. Consignment and Turnkey material procurement. Functional, in-circuit testing, and manufacturability recommendations. Board rework, repair, upgrade service and conformal coating.
Lead Time to Ship:
Prototypes 1-2 days after receipt of material. Pre-production 1 week plus longest material lead time. Production 3 weeks plus longest material lead time.
Manufacturing and Quality Standards:
IPC A-610 Class II and Class III, Workmanship Standards. All production staff IPC Certified. Utilizing continuous quality improvement. ISO Certified in 2016.
EPA:Meet all requirements. Closed-Loop, Aqueous Cleaning Process with zero discharge. No clean soldering process (w/ customer approval).
Ability to accomplish very complex fine pitch micro BGA assemblies on a quick turn basis.
In house in-circuit and functional testing capability.
A variety of applications such as memory boards, controllers, RF, processor boards, consumer electronics.
Four autoplacement lines capable of handling part sizes from 0201 discrete components to the largest BGA device.
Selective Solder Systems
BGA and Fine Pitch Capabilities:
Advanced device placement down to .5 mm BGA’s and 12 mill centers for QFP placement. In-house real time x-ray inspection is available.
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